Electronic Component Preparation for Mission-Critical Applications

High Reliability Electronics

Industries such as defense, aerospace, avionics, and space operate in environments where failure is not an option. Components must withstand extreme conditions. The integrity and durability of electronic components are critical. These sectors demand flawless performance under extreme conditions, and a minor defect can lead to catastrophic outcomes. 

Retronix’s robotic hot solder dip service is a cornerstone solution for meeting these rigorous standards, providing high-reliability industries with unparalleled quality and precision.

The Challenges of High Reliability Industries

Electronic components in high reliability applications face unique challenges. These include exposure to harsh environments, vibration, and the need for long life cycles. Components must also comply with stringent regulatory standards and mitigate risks such as tin whiskers and gold embrittlement. 

In defense applications, reliability can mean the difference between mission success and failure. Aerospace components face extreme vibrations, temperature fluctuations, and radiation. Modern avionics rely on intricate electronic systems. Space exploration demands components that perform flawlessly in zero gravity, vacuum, and extreme temperatures. 

Robotic Hot Solder Dip Service

Retronix’s robotic hot solder dip process involves the precise dipping of component leads into a batch of the desired solder alloy. This automated process ensures consistent quality and reliability, which are critical in high-stakes applications. Here’s how Retronix’s services stand out:

  • Enhanced Longevity and Reliability: By converting alloys on devices and refreshing oxidized alloys, Retronix significantly extends the life of electronic components. 
  • Tin Whisker Mitigation: Tin whiskers can cause short circuits and failures in electronic assemblies. Retronix’s automated solder conversion to lead (Pb) solder mitigates this risk, ensuring the safety and functionality of components in high-reliability applications.
  • Gold Embrittlement Solution: Gold in solder joints can lead to brittle connections. Retronix’s process de-golds and re-tins devices, eliminating this risk and promoting stronger, more reliable solder joints.
  • Versatility in Alloy Conversion: Whether converting from lead to lead-free alloys or vice versa, Retronix’s automated process accommodates a wide range of materials, including SAC305 and SN63Pb37. This flexibility is vital for organisations aiming to comply with various regulatory requirements or enhance product performance.

Quality Assurance and Industry Approvals

Quality is at the core of Retronix’s services. The in-house testing suite confirms the success of our processes, providing peace of mind and assurance of high-reliability outcomes.

Retronix has approvals from leading Tier 1 OEMs and EMS providers, reflecting our commitment to compliance for the highest industry standards. Retronix also has the AS9100D, AS6081 among other highly recognised global accreditations.

We maintain strict ESD (Electrostatic Discharge) controls, ensuring components remain unaffected by static electricity during the re-tinning process, each project is tailored to client specifications, whether it involves specific solder alloys or unique component geometries.

Work with Retronix

Retronix’s robotic hot solder dip services provide a critical solution, ensuring that electronic components meet the rigorous demands of these sectors. With enhanced reliability, risk mitigation, and a commitment to quality and sustainability, Retronix stands out as a trusted partner for organizations aiming to achieve excellence in their electronic assemblies.

Contact Retronix today to learn more about our robotic hot solder dip services and how we can support your mission-critical applications, or email us at contact@retronix.com