SOLDERABILITY TEST

In line with the JEDEC standards, Retronix uses the Solderability Test to ensure that your devices did not have solderability issues. 

This test is a great tool for assuring that any device that has gone through the tinning process has been successful. The solderability test measures the vertical force of buoyancy and surface tension of a fluxed component being immersed in molten solder.

Advantages of using the Solderability Test include:  

  • Guarantees a stable electrical contact as a component that passes the Solderability Test demonstrates a reliable contact with a good uniform bond.
  • Passing parts only need to be at the soldering temperatures for a short period this can reduce the risk of damaging heat-sensitive components.
  • Solderability can save costs by preventing poorly soldered parts from reaching production. 

The following measurements are taken on a Solderability Test:

  • Time to Zero: (Tb): The time the wetting curve takes to re-cross the zero line. 
  • Time to Buoyancy (Ta): The time the wetting curve takes to re-cross the buoyancy line. 
  • Time to 2/3 Fmax (T2/3): The time in seconds it takes for the force to reach 2/3 the maximum force. 
  • Force at Time 1+2: Measuring the force at predetermined points in the process. 
  • Wetting the Angle at Time 1+2: Measuring the angle of the dip at a predetermined time during the process. 

Further Information is Available  

Our Testing brochure provides further details of our suite of device testing services.  Safeguard your supply chains with our counterfeit detection service.

IC Testing Brochure Download 2

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