Component connections on today’s compact and densely populated PCBs are hidden by other components, making X-ray the only viable inspection solution. The purpose of 3D XRay inspection is to detect internal defects which would otherwise be invisible. The inspection reveals any presence of voids, foreign objects, or faulty, damaged wire bonds.
The advantage of 3D XRay inspection is that it is non-destructive and can be performed on most electronic components. In automated inspection, mode samples can be tested at the highest throughput. In manual mode, intuitive software and high-precision sample manipulation enable operators to visualize and evaluate the tiniest internal defects and deficiencies.
APPLICATIONS
- Solder reflow analysis
- BGA connectivity and analysis
- Solder void calculation
- Through hole measurement and inspection
- Die attach voiding measurement
- Ball bond analysis
- Stitch bond analysis
- Micro BGA / chip on chip analysis
- Pad array analysis
- Dry joint detection and analysis
There is an increasing demand for flexible, high-resolution, and cost-effective XRay inspection services to cope with the evolution of ever-shrinking geometries within electronic components and to comply with tighter quality standards.
