Reflow Reballing

For over 30+ years Retronix has been providing the reflow reballing service. The process involves running the components through a reflow cycle to attach the solder balls to the pads. 

Reballing is essential for maintaining the reliability and performance of electronic devices, especially when the original solder joints have become weak or damaged. This process demands a high level of precision and expertise to ensure the new solder balls are properly aligned and securely attached. The Retronix team, certified IPC, brings extensive experience and skill in reflow reballing. Over the years, they have successfully handled millions of devices for customers, consistently achieving minimal to no complaints.

This method is widely used by clients. Unlike Laser Reballing, which avoids the reflow cycle and thus minimizes thermal stress on components. Reflow Reballing remains a trusted and cost-effective solution for many high-reliability sectors.