Tin Whisker Mitigation: A Better Solution with Retronix Component Preparation Services

Tin whiskers pose a significant threat to the reliability of electronic devices. These microscopic filaments can grow from surfaces and connect to adjacent devices to short circuit, potentially causing device failures.

Various studies have been conducted on this area including one by NASA, exactly how and why tin whiskers grow is not completely understood, it was first identified within terrestrial electronics, but these whiskers are known to grow rapidly out of pure tin in the weightlessness, vacuum and temperature extremes of space, some of the other reasons include –

  • Stress in the plating
  • Micro fractures
  • Thin plating
  • Intermettalic compound formation
  • External Stress, vibrations, shock
  • Thermal Imbalance (CTE  – Coefficient Thermal Expansion)

A huge resource of information, case studies and extensive investigations of Tin Whiskers can be found on the NASA NEPP website – click here, as seen with some photo examples here.

The challenge with traditional methods

Previously, small devices were hand-dipped in tin, a method that was prone to inconsistencies and human error. This approach did not fully mitigate the risk of tin whiskers, leading many companies to adopt conformal coating as a workaround. However, conformal coating merely delays or partially mitigates the growth of tin whiskers instead of eliminating the root cause.

Solution

Therefore the Retronix solution is to convert the pure tin alloy on the termination to one with lead content, using a unique process that meets the stringent standards of high reliability industries.

  • Meets the GEIA-STD-0006
  • Fully automated and repeatable.
  • One of the only few companies in the world to offer a full bill of material conversion.
  • Mechanical Checks, Alloy Composition check using XRF, inhouse verification process, and bespoke factory system to provide fully traceable reports.

Retronix has developed an automated conversion process that addresses the core issue of tin whisker formation. By converting lead-free alloys to lead, we provide a more reliable and effective solution, particularly for micro device tinning. Our process adheres to the stringent GEIA standards, ensuring high-quality and consistent results.

Key benefits of our automated process include:

  • Full Bill of Material Conversion: Retronix offers a comprehensive solution, converting all relevant components to meet GEIA standards. This ensures consistent quality across the entire device.
  • Reduced Human Error: Automation removes the variability associated with hand-dipping, resulting in more reliable and uniform outcomes.
  • Root Cause Elimination: Unlike conformal coating, our process tackles the primary cause of tin whisker growth, providing a long-term solution rather than a temporary fix.

We aim to provide clear and actionable steps to help our customers achieve their goals.

Retronix’s Component Preparation Services represent a significant advancement in tin whisker mitigation. By automating the conversion of alloys from lead-free to lead and adhering to GEIA standards, we offer a superior alternative to traditional methods. Our solution not only reduces the risk of tin whiskers but also provides a more reliable and long-term fix.

For more information on how Retronix can help you address tin whisker issues effectively, please contact us today.