XRAY Inspection Service

X-Ray inspection plays a pivotal role in ensuring the integrity and functionality of electronic components, a necessity in today’s technology-driven world. This method allows for a non-invasive, detailed examination of internal structures, identifying defects or inconsistencies that might not be visible to the naked eye. It’s particularly effective in spotting soldering issues, component misalignments, and even counterfeit parts, which pose significant risks to the reliability of electronic devices.

The use of X-ray inspection helps secure supply chains by verifying the authenticity and quality of components before they are integrated into critical systems. By employing this technique, manufacturers and suppliers can maintain high standards of quality control, mitigate the risk of failures, and uphold the trust of their customers. In doing so, it ensures not only the performance of individual components but also the safety and reliability of the electronic devices.

Applications

  • Solder reflow analysis
  • BGA connectivity and analysis
  • Solder void calculation
  • Through hole measurement and inspection
  • Die attach voiding measurement
  • Ball bond analysis
  • Stitch bond analysis
  • Micro BGA / chip on chip analysis
  • Pad array analysis
  • Dry joint detection and analysis

There is an increasing demand for flexible, high-resolution, and cost-effective XRay inspection services to cope with the evolution of ever-shrinking geometries within electronic components and to comply with tighter quality standards.

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