Automated Alloy Conversion
We are one of the few companies to offer a Full Bill Of Material (BOM) conversion process
The Retronix fully automated alloy conversion system ensures that devices are not exposed to excessive heat, time, abrasion and meet the High Reliability standards of the GEIA-STD-0006. Retronix has also pioneered technology to tin micro devices, including 0402s, 0603s, SOTs to GEIA STD, meaning the industry now has a comprehensive, all-inclusive solution for tinning requirements.
Since the ban on Pb, manufacturers of High Reliability electronics have been working on many different strategies to prevent tin whiskers, with varying levels of success. Most popularly, manufacturers apply solder paste to components for self-mitigation. However, this process assumes some element of risk as the lead solder from the paste only covers the sides of the termination but does not reach the top surface. In the High-Reliability world, there is no room for error.
Our automated Alloy Conversion process ensures lead solder covers all sides of capacitor terminations.
STEP 1
The automated vacuum tool transports the device from the carrier tray.
STEP 2
Each side of the device is fluxed, in sequence.
STEP 3
The device is pre-heated and temperature checked.
STEP 4
Each side is dipped in the dynamic solder wave.
STEP 5
The device is returned to the carrier tray.
STEP 6
The devices are cleaned, re-baked, vacuum packed with moisture sensitivity desiccant.
Further Information is Available
Our Full BOM tinning brochure provides further details on our specialised service which can mitigate tin whiskers, convert from RoHS to Non-RoHS and vice versa.
