What is Robotic Solder Dip (Retinning, Alloy Conversion, Alloy Refresh)?

Posted on 29 August 202529 August 2025 by Maulin Buch

What is Robotic Solder Dip (Retinning, Alloy Conversion, Alloy Refresh)?

The integrity of every electronic component matters in high-reliability industries. That’s why processes such as robotic solder dip – also known as retinning, alloy conversion, or alloy refresh play a vital role in protecting supply chains and extending component life.

What is Robotic Solder Dip?

Robotic solder dip is a controlled process that removes old or compromised tin finishes from component leads and replaces them with fresh solder.

Depending on alloy composition, it helps eliminate defects such as tin whiskers and ensures components meet the required alloy specification for their end-use environment.

The process is especially important in defence, aerospace, avionics, and space applications, where failure is not an option.

When do you need this service?

This technique is applied in several scenarios:

Alloy conversion – where components need to be converted from lead-free to tin/lead finishes, or vice versa, to match system requirements.
Alloy refresh – where parts have been stored for extended periods and the finish has oxidised or become unsuitable for assembly.
Retinning – to repair or restore solderability on aged or contaminated leads.
Counterfeit mitigation – providing assurance that the leads are refreshed and genuine before deployment.

In every case, the goal is the same: improved solderability, extended component lifespan, and reduced risk of in-field failures.

How is Robotic Solder Dip Done?

The process combines robotics, precision control, and strict standards. At Retronix, it typically follows these steps:

Component Preparation – Devices are carefully checked and, if required, masked to protect sensitive areas from solder exposure.
Robotic Handling – Components are loaded into a robotic system, ensuring consistent positioning and movement.
Flux Application – A precise amount of flux is applied to promote wetting and improve solder adhesion.
Controlled Immersion – The robotic arm dips the leads into a solder bath at tightly controlled angles, depths, and dwell times.

Alloy Replacement (if required) – The old finish is stripped away and replaced with the required solder alloy (such as tin/lead or lead-free).
Cooling and Cleaning – Parts are then cleaned to remove any flux residues.
Inspection and Testing – Every batch is checked for solderability, finish quality, and compliance with standards such as GEIA-STD-0006.

This repeatable and traceable process ensures every component meets the highest level of reliability and performance.

Why does automation matter?

Traditional manual solder dip methods are widely used across the industry and, when performed by skilled technicians, can achieve good results. Many companies rely on manual dipping for certain applications, and it remains an accepted practice.

However, manual methods naturally introduce more variability. Temperature, dwell time, and immersion angles can be harder to control by hand, which may affect repeatability in critical applications.

That’s why Retronix has invested in state-of-the-art robotic systems. Automation ensures:

Consistent process control across every component.
Repeatability and precision, vital for aerospace and defence standards.
Compliance with international standards including GEIA-STD-0006.
Traceability – with full process records for customer confidence.

Our robotic solder dip solutions are designed with both precision and flexibility in mind. Whether you need a full alloy conversion programme for thousands of components, or a refresh for a critical batch of spares, our systems deliver the highest levels of reliability.

By combining advanced robotics with decades of expertise, we help customers reduce risk, ensure compliance, and extend the usable life of their electronic components. That’s why leading organisations across aerospace, defence, and other high-reliability industries choose Retronix.

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Reballing: What Is It And When Do You Need It?

Posted on 12 August 202512 August 2025 by Maulin Buch

Reballing Components: What is it, and when do you need it?

Printed circuit boards (PCBs) are the brains of all modern electronics, from your phone to complex aerospace equipment. At their heart are tiny, intricate connections that link the components to the board. Over time, or during certain repair and refurbishment processes, these connections become damaged, oxidised, or unsuitable for the intended application.

When these connections fail, the whole device fails.

So, what is Reballing?

Put simply, reballing involves removing old solder balls from a BGA component and replacing them with new ones of the correct alloy, size, and specification.

BGA’s are a type of surface-mount packaging that uses an array of solder balls to connect the integrated circuit to the PCB. These tiny solder spheres are essential for creating thousands of reliable electrical connections in a small area.

Over time, these solder balls can become cracked, corroded, or damaged. Reballing involves carefully removing the old solder balls from the component’s underside and replacing them with a fresh, uniform array of new solder balls. The goal is to restore the component’s electrical integrity, ensuring it can be reliably mounted back onto a PCB.

When is Reballing used?

Reballing is common in several situations:

Changing solder alloys – for example, switching from lead-free to tin-lead for high-reliability or legacy systems.
Repair and refurbishment – restoring components removed from boards.
Upgrading or repurposing parts – ensuring compatibility with specific assembly requirements.
Addressing damage – when solder balls are contaminated, oxidised, or physically damaged.

How is Reballing done?

The traditional reballing process involves a technique called ‘reflow’. This requires heating the component to a temperature high enough to melt the solder, which can be a double-edged sword. While it’s necessary to create the connection, this high-heat exposure can stress the component and cause a range of issues, from micro-cracking to component degradation. Component manufacturers have recommended that a component not go through more than 3 reflow cycles. Each extra cycle can stress the device, potentially affecting performance or lifespan.

The Retronix Laser Reballing Advantage: Avoiding Reflow Cycles

Retronix uses a laser reballing process that targets only the solder area, avoiding the need to heat the entire component. This means:

No additional full reflow cycles – reducing thermal stress on devices.
Precision and repeatability – ensuring each solder ball is placed with exact accuracy.
Better reliability – components are handled in a way that preserves their integrity.
Compliance with industry standards – giving customers confidence in long-term performance.

Our process is designed for speed, accuracy, consistency and zero compromise on quality

We have invested in advanced equipment and stringent quality controls so our customers receive components that are production-ready, every time. Because when it comes to reballing, the smallest details matter. Alloys. Ball size. Consistency. Placement accuracy. Thermal history. We manage them all.

Whether you need a single batch or ongoing high-volume reballing support, Retronix delivers a service trusted by leading manufacturers worldwide. Our combination of laser technology, experienced operators, and industry certifications makes us the first choice for businesses where reliability cannot be compromised.

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The Quiet Deadline: How Obsolescence Shapes Modern Production

Posted on 1 August 20251 August 2025 by Maulin Buch

The Quiet Deadline: How Obsolescence Shapes Modern Production

A quiet but significant issue is at play in the world of manufacturing and technology: component obsolescence. It’s an issue that can bring production lines to a halt, trigger expensive redesigns, and threaten the long-term viability of products across a huge range of industries.

When a manufacturer issues an End-of-Life (EOL) notice for a component, it sends a powerful message to the entire industry. The notice often specifies a last-time-buy date, a final shipment date, and an end-of-support date.

This triggers a flurry of activity for any business that relies on that part. Companies must assess their current inventory, forecast future needs, and make a crucial decision: place a large, one-time “lifetime” buy to secure enough components to last for the product’s entire lifecycle, or initiate a potentially expensive and time-consuming redesign of their product to use an alternative part.

Who feels the pain?

Component obsolescence affects all industries differently. Sectors with long product lifecycles, such as aerospace, defence, medical devices, and rail, are particularly vulnerable. A piece of equipment designed to last for decades, like a train signalling system or a piece of medical imaging technology, often relies on components that may only be in production for a few years.

This EOL notice is the starting pistol for a race against time, forcing procurement teams, engineers, and supply chain managers to find a solution that avoids production line shutdowns and future product support issues.

This creates a critical mismatch, requiring companies to manage a continuous process of sourcing and replacing parts to ensure functionality and safety. For these sectors, a component becoming obsolete is a strategic and operational risk that can compromise safety, reliability, and regulatory compliance.

However, the problem isn’t limited to these fields. Automotive manufacturers, industrial automation companies, and even consumer electronics firms also face these challenges.

A discontinued part can disrupt production lines, increase costs, and lead to delays. The interconnected nature of the global supply chain means that a single point of failure can have widespread consequences.

The Accelerating Trends

Several trends are accelerating the rate at which components become obsolete. The rapid pace of technological innovation is a primary driver. As new and improved parts are developed, manufacturers naturally shift their focus, phasing out older, less efficient components. This has significantly reduced the average lifespan of many semiconductors.

Other factors include market demand and economic incentives. When demand for a legacy part drops, it often becomes uneconomical for a manufacturer to continue production. regulatory changes, like new environmental or safety standards, can force a part to be discontinued if it no longer complies. Supplier consolidation through mergers and acquisitions can also lead to product line rationalisation, where less profitable components are cut.

The Strategic Solution

To manage these challenges, businesses are increasingly turning to strategic partners. This is where Retronix comes in providing solutions that mitigate the risks associated with component obsolescence. Retronix’s services focus on the recovery and refurbishment of obsolete parts. We can recover discontinued electronic components from existing stock, prepare them for reuse, and reintroduce them into the supply chain.

A cornerstone of this offering is reballing and retinning processes that restore the integrity of a component’s solderability and connections, making it ready for use in a new system. Retronix also provides comprehensive testing to ensure every refurbished component meets strict quality standards.

By offering these services, Retronix helps companies extend the life of their products, reduce waste, and avoid the costly and time-consuming process of a full redesign.

Having a reliable partner like Retronix with specialised expertise is a significant advantage.