RESEARCH & DEVELOPMENT SUPPORT CAPABILITIES
Retronix offer a range of unique services for anyone having to modify or build a PCB in order to measure specific data. Applications for this include designing in a new component and failure analysis, among many others.
Retronix offers advantages in terms of speed of result and cost reduction, but the main advantage is we can do all this using processes that pose much less risk to the component & PCB, so accuracy of data is better. Also we eliminate mechanical connections, which can lead to signal loss, also improving data accuracy.
Retronix, for 27 years, have specialised in the component and PCB modification for the high reliability electronics industry (Eg. Aerospace, Defence) to provide solutions for Obsolescence for example. This has led us to develop a set of processes which are unique, and work brilliantly in PCB modelling.
Check out how the unique services work together for an innovative solutions below.
Device Removal
Removing IC’s from PCB’s can lead to damage, or software corruption. Retronix have a number of safer techniques including bottom heat removal which ensures the IC subject to minimal heat.
device reballing
Retronix use a laser process to replace balls on a device which eliminates any reflow cycle, thereby avoiding heat damage. A process which is automated, controlled and repeatable.
device testing
This test is used to check the electrical parameters of every pin to pin e.g. current, voltage, diode resistivity, and silicon connectivity. It allows us to detect whether a component is defective or not.
bespoke solutions
Where height has to be added, we change a gripper socket to a column of solder, instantly created, solderable, a fraction of the cost and eliminates mechanical connections, replacing them with more reliable solder connections.
Use of low temperature solder. This doesn’t have the long term robustness of normal solder, but that isn’t needed in prototyping/R&D. It avoids potential heat damage.
