UK SPACE CONFERENCE - RETRONIX at STAND F1
exciting new developments
Retronix continues to lead the industry in micro device tinning and laser reballing, bringing exciting and new developments to high-reliability solutions.
Micro device tinning, a process of applying a new layer of solder on devices, has been significantly enhanced for improved reliability and reduced failures, essential for sectors like aerospace and space. The automated process contributes to the longevity of these critical components.
For many years high reliability industries, involved in PCB assembly, have converted lead free electronic components to tin/lead in order to protect against tin whiskers. This problem has become more common due to minaturisation of electronics
However there has never been a suitable solution for passive chip components, such as chip caps and resistors, due to their size and difficulty in handling them, until now.
RETRONIX SOLUTION
With the automated process designed by Retronix for Tinning micro components including 0402’s, 0603’s, SOT’s and many more to the GEIA Standard. The industry finally has the solution for tinning requirements.
The automated micro tinning process is carried out on our approved plating systems.
The components are picked up by a specially designed tool that can hold multiple devices at a time.
The automated system ensures the dip is precise and consistent.
