Gray Market – Don’t get burnt by Counterfeit Chips

The Gray Market - Don't get Burnt by Counterfeit Chips

With the electronic component shortage predicted to last until at least 2022, Retronix has not only seen a significant growth of customer requirements for our testing services. But alarmingly, the quantity of counterfeit chips and suspicious components that we are detecting has risen significantly also. During any time of shortage, we observe a spike however, the severity of this particular supply crisis has dramatically worsened the counterfeit chip problem. 

Playing with fire

The top manufacturers within the computing industry are lucky enough to receive orders directly from the chip manufacturers. However, manufacturers from other industries such as automotive, white goods, and medical electronics, source their chip stock from intermediary suppliers. Now because it is near enough impossible for these suppliers to obtain chips directly from the source, many have been exploring alternative channels. As a direct result, the gray market for semiconductors has grown, at an exponential rate.

“The gray market refers to the sale of products via distribution channels that are unintended, unofficial and unauthorised by the real vendor of the products.” Techopedia 

Dubious sellers are taking advantage of the dire situation, luring in desperate buyers with the likes of search engine ads and swindling them fake chips under the guise of genuine stock. 

The Danger of Counterfeit

According to Semiengineering, the counterfeit chip market is growing with a worldwide value of $75 billion. Hand in hand with the industry becoming more lucrative, counterfeiters are becoming more sophisticated in their techniques. However, the difference between genuine semiconductors and fakes semiconductors couldn’t be more extreme. As explained by the Semiconductor Industry Association, chip manufacturers spend billions of dollars each year developing, manufacturing, and testing products that will perform to the highest standards and reliability levels for many years.

Counterfeiters, on the other hand, will repurpose components from old electronic waste using crude and poorly controlled processes that churn out semiconductors with far higher failure rates. This inherently effects the long-term reliability of these devices and worryingly jeopardises lives since they are prone to fail at the worst possible moments, such as when car airbags need to deploy, defibrillators are used to apply shocks, or when aircraft are landing.

XIlINX Device our Test Department Detected as Compromised

XILINX device with 2D barcode rubbed off

barcode 2

XILINX device with 2D barcode

Don't get duped by counterfeiters

Retronix has a test department dedicated to the identification of counterfeit parts along with the best tools for this process. We also have years of experience earned from dealing with this issue for numerous customer in varying industry sectors. 

Due to the supply chain shortage, our test department has been uncovering new and inventive techniques that we have never seen. For example, we are starting to see chips with 2D Barcodes that have been laser-etched off. Suppliers will say that the 2D Barcode was only removed to conceal how the parts made it into the open market, encouraging desperate buyers to use the parts, assuring them the functionality of the devices will not be compromised. Don’t fall for it! Any device which has been visibly altered or changed should be considered compromised or counterfeit. This issue has also recently been raised by ERAI and more information can be found on a discussion on the ERAI: Counterfeit Part Avoidance, Detection, Disposition and Reporting Linkedin page.

If you have acquired components from an unverified source or are unsure about the authenticity of the parts, please get in touch with Retronix today. 

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Tin Whisker Trials & Tribulations | Finally a Micro Component Tinning Solution

Tin Whisker Trials & Tribulations - A Solution to Micro Component Tinning

It’s a well-known fact (there are hundreds of technical papers confirming) that Tin Whisker filaments can grow uncontrollably from tin plating. The danger comes when one of these filaments peels off the tin and connects with an adjacent component causing a short.

When the EU Restriction on Hazardous Substances (RoHS) directive came into place, the High Reliability industry braced itself for an influx of tin whisker issues. That was back in 2011 and thankfully since several techniques and applications to tame the tin needles have been identified.

The Solder Dip Solution

The most common method to eliminate tin whiskers is to convert the plating from ‘lead-free’ (tin plating) to tin/lead plating. The process is carried out by simply dipping a component’s terminations into tin-lead solder. High Reliability industries (aerospace/defence/medical) are allowed dispensation to use tin/lead solder, as they cannot run the risk of tin whiskers long term. Unlike, commercial products such as phones/laptops that have a much shorter life cycle.

However, it’s still not that simple as the conversion process needs to conform to a standard called GEIA which strictly controls dip time and temperature, plus it must be automated. 

The problem is that 0402, 0603, and SOT chip capacitors cannot (until now) be handled in a manner that allows for automation. Such micro components are processed manually by someone picking them up with tweezers and hand dipping in a solder pot. It’s important to note that the success of solder dipping as a solution to protect against tin-whiskers directly depends on coating the exposed tin-plated surface (Electronic Design)

The Cut Corner Solution

Despite this knowledge, many manufacturers are rejecting hand dipping, instead believing that assembling PCBs with lead paste will resolve this issue. The consequence of this workaround is that the lead solder from the paste only covers the sides of the termination but does not reach the top surface. As widely reported by NASA, this process DOES NOT protect against the risk of Tin Whiskers. 

Despite such clear evidence, the general thought process around the tinning of micro components such as capacitors and resistors is, “there is no suitable process that meets the GEIA standard, therefore it’s not a problem” so, issue a concession to bypass it. Or do the above which is a partial solution but not good enough.

The Retronix Solution

With the automated process designed exclusively by Retronix – Patent Pending – to tin micro devices such as 0402, 0603, SOT’s to GEIA standards, the industry finally has a comprehensive all-inclusive solution for tinning requirements.

  • The automated micro tinning process is carried out on our plating systems.
  • The lead-free capacitors are picked up by a specially designed tool that can hold multiple devices at a time.

The devices are moved to the fluxing station & then accurately over the solder wave. The pre-programmed automated system ensures the dip is precise & consistent.

Click HERE to learn more about our Micro Device Hot Solder Dip Process – Patent Pending. 

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